Engineered down to the microvolt.

Circuits, firmware and data systems. Measured, not estimated.

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01Proof

Measured on a bench.

Not copied from a datasheet.

0KParameters in a single model
0 KBOn-device footprint
<1 µVInput-referred noise
0-bitADC resolution
<0 msReal-time latency
02Sense

We build the device.

Circuits, PCBs, firmware and enclosures. In-house, end to end.

Biopotential

EMG, EEG, ECG, EGG front-ends

PLC & automation

IEC 61131-3 on Delta and Siemens

Robotics & motion

ROS 2 with real-time control

RF & wireless

Antennas to protocol stacks

In development
03Shrink

Then we make it swallowable.

11 × 26 mmCapsule size
72 hrZinc-air battery
434 MHzRF + BLE telemetry
Imaging Pressure pH Temp 26 mm 11 mm
04Build

One team, board to bench.

No hand-offs. You own every file.

SchematicKiCad, 2–4 layers
FirmwareSTM32, nRF52
EnclosureFusion 360, SLA
HandoverBOM, source, docs
05Clean

Noise in. Signal out.

Keep scrolling. Watch the noise floor drop.

CMRR > 120 dB4 kV isolation1 kHz sampling
EMG
EEG
ECG
EGG
Noise floor24.0 µV
06Connect

Software that runs it.

Designed with the hardware. Never bolted on. Our Diagnostic Information System runs this stack end to end — registration, billing, radiology, pathology, PACS/DICOM imaging and WhatsApp report delivery, with server-enforced role access across every branch.

FastAPIReactMQTTTimescaleDBFHIR R421 CFR Part 11DICOM / PACS
Device MQTT TimescaleDB API Dashboard Patient app EMR / LIMS CliniciansReact NativeFHIR, HL7
07Decide

Signal becomes a decision.

Trained in PyTorch. Runs on a Cortex-M.

TFLiteONNXCMSIS-DSPPK/PD in NONMEM
5 KB Raw signal238K paramsCortex-M<4 ms
08Tools

What we actually use.

Four toolchains. One bench.

Microcontrollers

STM32 F4/L4nRF52840ESP32-S3FreeRTOSZephyr

PCB & mechanical

KiCad 7/8Fusion 360JLCPCBFDM / SLA

Applications

FastAPINext.jsReact NativeDocker / K8sAWS

Signal & AI

PyTorchTFLite / ONNXSciPyNONMEMMLflow
09Deliver

No surprises, by design.

  1. Scoping call with an engineer
  2. Written, fixed-price proposal
  3. Working demos every two weeks
  4. Full handover of source and schematics

Typical timelines, in weeks

081624 Custom PCBFirmware + appRoboticsCapsule module 4–108–2012–2416–28
IEC 60601-1Electrical safety
IEC 61131-3PLC programming
21 CFR Part 11Pharma software
ISO 13485Quality management

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